TOP｜ 特許｜ 意匠｜ 商標
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公開日2025-04-16
公報種別公開国際商標公報
国際登録番号1838905
国際登録日2024-10-02
区分第40類(製造・加工),第42類(科学・技術)
商品役務Custom assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, for others; providing technical information in the field of product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, and technical consulting and manufacturing process consulting related thereto.,Software engineering services; engineering and testing services in the field of assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits全 57 件を表示, integrated circuit packaging and integrated circuit chips or devices, for others; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing facilities featuring equipment for others for testing electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices; development and establishment of testing specifications and procedures, including wafer sorting procedures, all for the purpose of testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; final product quality testing services in the field of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; packaging design services for others in the field of packaging for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing scientific and technical information in the field of product design, product development, product engineering, and product testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, and advice and consultation relating thereto.
基礎出願番号98494542
基礎出願日2024-04-11
基礎出願国US
出願人Stats Chippac Pte. Ltd.
OCRテキストSTATSChipPAC
OCRテキスト2
OCRについて
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